Modeling Electromigration for Microelectronics Design

Electromigration Modeling for Interconnect Structures in Microelectronics

Electromigration is one of the most important reliability issues in semiconductor technology. Its complex character demands comprehensive physical modeling as basis for analysis. Simulation of electromigration induced interconnect failure focuses on the life-cycle of intrinsic voids, which consists of two distinct phases: void nucleation and void evolution. We present models for both phases as ...

Computer Simulation of ElectroMigration in Microelectronics Interconnect

Electromigration in Interconnect Structures of Microelectronics Circuits

We present a comprehensive physical model for the whole life cycles of electromigration induced voids. Special emphasis is put on explaining the void morphology and its impact on interconnect resistance. Investigations for common twoand three-dimensional interconnect structures are presented. Implications of the theoretical analysis and the simulation results for modern interconnect design are ...

Design Autom 38 . Design Automation for Microelectronics

Design automation or computer-aided design (CAD) for microelectronic circuits has emerged since the creation of integrated circuits (IC). It has played a crucial role to enable the rapid development of hardware and software systems in the past several decades. CAD techniques are the key driving forces behind the reduction of circuit design time and the optimization of circuit quality. Meanwhile...

Design and modeling of equipment used in electrochemical processes for microelectronics

This paper presents an overview of the design of electrochemical processing equipment for semiconductor and related microelectronic manufacturing as well as a review of publications that are applicable to electrochemical wafer process equipment. We discuss several types of electrochemical processes applicable to wafer processing and the considerations that go into automated equipment for these ...